Yıl: 2019 Cilt: 27 Sayı: 6 Sayfa Aralığı: 4220 - 4230 Metin Dili: İngilizce DOI: 10.3906/elk-1903-112 İndeks Tarihi: 22-05-2020

Defect detection of seals in multilayer aseptic packages using deep learning

Öz:
Sealing in aseptic packages, one of the healthiest and cheapest technologies to protect food from parasites inthe liquid food industry, requires a detailed and careful control process. Since the controls are made manually and visuallyby expert machine operators, the human factor can lead to the failure to detect defects, resulting in high cost and foodsafety risks. Therefore, this study aims to perform a leak test in aseptic package seals by a system that makes decisionsusing independent deep learning methods. The proposed Faster R-CNN and the Updated Faster R-CNN deep learningmodels were subjected to training and testing with a total of 400 images taken from a real production environment,resulting in a correct classification rate of 99.25%. As a result, it can be said that the study is the second study thatperforms a computer-aided quality control process with promising results, having distinctive features such as being thefirst study that conducts analysis using the deep learning method.
Anahtar Kelime:

Konular: Mühendislik, Elektrik ve Elektronik Bilgisayar Bilimleri, Yazılım Mühendisliği Bilgisayar Bilimleri, Sibernitik Bilgisayar Bilimleri, Bilgi Sistemleri Bilgisayar Bilimleri, Donanım ve Mimari Bilgisayar Bilimleri, Teori ve Metotlar Bilgisayar Bilimleri, Yapay Zeka
Belge Türü: Makale Makale Türü: Araştırma Makalesi Erişim Türü: Erişime Açık
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APA Adem K, KOZKURT C (2019). Defect detection of seals in multilayer aseptic packages using deep learning. , 4220 - 4230. 10.3906/elk-1903-112
Chicago Adem Kemal,KOZKURT CEMIL Defect detection of seals in multilayer aseptic packages using deep learning. (2019): 4220 - 4230. 10.3906/elk-1903-112
MLA Adem Kemal,KOZKURT CEMIL Defect detection of seals in multilayer aseptic packages using deep learning. , 2019, ss.4220 - 4230. 10.3906/elk-1903-112
AMA Adem K,KOZKURT C Defect detection of seals in multilayer aseptic packages using deep learning. . 2019; 4220 - 4230. 10.3906/elk-1903-112
Vancouver Adem K,KOZKURT C Defect detection of seals in multilayer aseptic packages using deep learning. . 2019; 4220 - 4230. 10.3906/elk-1903-112
IEEE Adem K,KOZKURT C "Defect detection of seals in multilayer aseptic packages using deep learning." , ss.4220 - 4230, 2019. 10.3906/elk-1903-112
ISNAD Adem, Kemal - KOZKURT, CEMIL. "Defect detection of seals in multilayer aseptic packages using deep learning". (2019), 4220-4230. https://doi.org/10.3906/elk-1903-112
APA Adem K, KOZKURT C (2019). Defect detection of seals in multilayer aseptic packages using deep learning. Turkish Journal of Electrical Engineering and Computer Sciences, 27(6), 4220 - 4230. 10.3906/elk-1903-112
Chicago Adem Kemal,KOZKURT CEMIL Defect detection of seals in multilayer aseptic packages using deep learning. Turkish Journal of Electrical Engineering and Computer Sciences 27, no.6 (2019): 4220 - 4230. 10.3906/elk-1903-112
MLA Adem Kemal,KOZKURT CEMIL Defect detection of seals in multilayer aseptic packages using deep learning. Turkish Journal of Electrical Engineering and Computer Sciences, vol.27, no.6, 2019, ss.4220 - 4230. 10.3906/elk-1903-112
AMA Adem K,KOZKURT C Defect detection of seals in multilayer aseptic packages using deep learning. Turkish Journal of Electrical Engineering and Computer Sciences. 2019; 27(6): 4220 - 4230. 10.3906/elk-1903-112
Vancouver Adem K,KOZKURT C Defect detection of seals in multilayer aseptic packages using deep learning. Turkish Journal of Electrical Engineering and Computer Sciences. 2019; 27(6): 4220 - 4230. 10.3906/elk-1903-112
IEEE Adem K,KOZKURT C "Defect detection of seals in multilayer aseptic packages using deep learning." Turkish Journal of Electrical Engineering and Computer Sciences, 27, ss.4220 - 4230, 2019. 10.3906/elk-1903-112
ISNAD Adem, Kemal - KOZKURT, CEMIL. "Defect detection of seals in multilayer aseptic packages using deep learning". Turkish Journal of Electrical Engineering and Computer Sciences 27/6 (2019), 4220-4230. https://doi.org/10.3906/elk-1903-112