Gyroscopes are inertial sensors that measure angular rotation and rate. They have a wide range of applications in both civilian and military fields, including automotive safety systems, video camera stabilization, route stabilization and inertial navigation in unmanned air vehicles, industrial robotics platforms, and some other military applications like smart missiles. Conventional high-performance mechanical and laser ring gyroscopes are mostly used in a limited number of military applications, due to their high manufacturing and maintenance costs, large volumes and masses. Instead, small volume, low-cost, and lower-performance gyroscopes can be integrated in many different platforms including civilian applications, with the help of MicroElectroMechanical Systems (MEMS) technologies, which are based on mature microelectronic technology. In addition, these microgyroscopes can be easily monolithically integrated with 1C readout circuit chips forming a microsystem shrinked in a compatibly small volume. The performances of MEMS gyroscopes are still below the performance levels of conventional gyroscopes, however, their performances increase sharply, and they even created some new application fields for themselves. This research presents the development of a new microgyroscope structure, which would adress and remove some basic problems in MEMS gyroscopes. The operation of the new structure is first verified by simulations, and various layouts of the structure are drawn for both nickel electroplating and dissolved wafer silicon micromachining processes. During the research, the setup for nickel electroplating have been fully constructed and optimized to grow high-quality nickel electrodeposits. This is also valid for the dissolved wafer process, except the deep reactive ion etching (DRIE) step, whose cost is far beyond the budget of this project. Following the construction of both fabrication setups, the designed gyroscopes have been fabricated in both processes and tested. It has been verified that the parasitic capacitances of the fabricated gyroscopes have been decreased from 3pF down to 30fF, compared to the first version gyroscopes fabricated at a company in the US. This improved the signal-to-noise ratios by at least two orders of magnitude. In parallel to gyroscopefabrication, two capacitive buffer-type interface circuits to pick the high-impedance output signal from the gyroscopes that have input capacitances in the range 20-250fF, have been designed, fabricated in a standard O.Sum CMOS process in Europe, and tested to verify the design values. These circuit chips are then hybrid connected to the gyroscope chips and the resonance behaviours of the gyroscopes have been tested both at atmospheric pressure and at 30mTorr vacuum. Mechanical quality factors of 500 for nickel and 14,000 for the silicon gyroscopes (at vacuum) have been demonstrated. Finally, one of the silicon gyroscope prototypes have been tested with a rate table and produced a scale factor of 0.56deg/sec in 50Hz bandwidth with a bias of 142deg/sec. The measurements reveal that the gyroscope can provide a rate sensitivity of 0.03deg/sec in 50Hz bandwidth or 15deg/hr in 3Hz bandwidth, when operated with matched drive and sense mode resonance frequencies. In summary, with this study, the first national implementation of gyroscopes with novel structures is achieved, the CMOS readout circuits that are necessary for these gyroscopes have been designed and fabricated, these readout circuits have monolithically been attached to gyroscopes, and the operation of the gyroscopes have been verified with various tests. This study have resulted in a very important knowledge and experience on gyroscopes that are considered as critical technology. Based on this knowledge and experience, our studies will continue to develop more sensitive gyroscopes that our defense industry needs.